Japan, Jan. 16 -- RENESAS ELECTRONICS CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2021-189169 Category (FI): G0... Read More
Japan, Jan. 16 -- CKD CORP,UNIV OF ELECTRO-COMMUNICATIONS,FUJI CORP,USHIO INC,ORIGIN:KK has got intellectual property rights for 'DEVICE OF MANUFACTURING TIN-BASED PEROVSKITE LAYER.' Other related det... Read More
Japan, Jan. 16 -- MARUZEN PHARMACEUT CO LTD has got intellectual property rights for 'METHOD FOR PRE-TREATMENT AND METHOD FOR DETERMINING QUANTITY.' Other related details are as follows: Application ... Read More
Japan, Jan. 16 -- MITSUBISHI PENCIL CO LTD has got intellectual property rights for 'WRITING INSTRUMENT.' Other related details are as follows: Application Number: JP,2023-038246 Category (FI): B43K... Read More
Japan, Jan. 16 -- JTEKT CORP,TOYOTA MOTOR CORP,DENSO CORP has got intellectual property rights for 'VEHICULAR CONTROL DEVICE.' Other related details are as follows: Application Number: JP,2022-102097... Read More
Japan, Jan. 16 -- TOYOTA MOTOR CORP has got intellectual property rights for 'DRIVING DEVICE.' Other related details are as follows: Application Number: JP,2021-168597 Category (FI): B60K6/365,B60K6... Read More
Japan, Jan. 16 -- JSR CORP has got intellectual property rights for 'RADIATION-SENSITIVE COMPOSITION, CURED FILM AND METHOD FOR PRODUCING THE SAME, LIQUID CRYSTAL DISPLAY DEVICE, AND ORGANIC EL DISPLA... Read More
Japan, Jan. 16 -- AGC INC has got intellectual property rights for 'CLEANING AGENT COMPOSITION, AND CLEANING METHOD.' Other related details are as follows: Application Number: JP,2021-167470 Categor... Read More
Japan, Jan. 16 -- RAN TECHNICAL SERVICE KK has got intellectual property rights for 'THIN SUBSTRATE BONDING AND PEELING METHOD, THIN SUBSTRATE MANUFACTURING METHOD, THIN SUBSTRATE, PEELING DEVICE, AND... Read More
Japan, Jan. 16 -- OHBAYASHI CORP has got intellectual property rights for 'CONCRETE TESTING METHOD AND CONCRETE TESTING SYSTEM.' Other related details are as follows: Application Number: JP,2021-1671... Read More